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2. Monitoring of curing process of siloxane resin by dielectric analysis
- Creator:
- Hron, Petr, Burian, Miloslav, Hytychová, Šárka, Inneman, Adolf, and Sucharda, Zbyněk
- Format:
- print, bez média, and svazek
- Type:
- article, články, model:article, and TEXT
- Subject:
- Geologie. Meteorologie. Klimatologie, dielektrická analýza, dielectric analysis, polysiloxane resins, curing process, dopant, 7, and 551
- Language:
- English
- Description:
- The knowledge of the curing process of polysiloxane resin is an important factor for the optimal preparation of the precursor of ceramic materials/composites/. It was observed that different physical method explaining the cure process e.g. /IR, NMR/ and examined experimentally the method of dielectric analyses/DA/. It was found that the method DA with the addition of the dopant makes the monitored system to increase its conductivity for the certain type of polymer. This enables to influence the properties of the final composite during its curing with the help of the approprietly selected temperature and pressure depending on time., Petr Hron, Miloslav Burian, Šárka Hytychová, Adolf Inneman and Zbyněk Sucharda., and Obsahuje bibliografii
- Rights:
- http://creativecommons.org/licenses/by-nc-sa/4.0/ and policy:public